Useful Links

Publications

Google Scholar: Click here     Research Gate: Click here     ResearcherID: Click here

PEER-REVIEWED JOURNAL PUBLICATIONS

2024

Mondal, M. T. H., Alam, M. S., Hossain, R., and Moore, A. L., “Heat transfer and phase interface dynamics during impact and evaporation of subcooled impinging droplets on a heated surface ” Applied Thermal Engineering 248, 2024, 123152. DOI: 10.1016/j.applthermaleng.2024.123152 [Link]

Mondal, M. T. H., Hossain, R., Martin, R., and Moore, A. L., “Independent microscale sensing of phase interface and surface temperature during droplet evaporation ” Applied Thermal Engineering 236, 2024, 121477. DOI: 10.1016/j.applthermaleng.2023.121477 [Link]

Davani, S., Zhang, B., Doran, B., Hansen, L., Khan, M., Roodbari, M., Meng, W. J., and Moore, A. L., “Subcooled Pool Boiling on Hierarchical Micro- and Nanostructure-Modified Copper Surfaces in HFE-7100 Dielectric Liquid ” Nanoscale and Microscale Thermophysical Engineering 28:1, 2024, 59-68, DOI: 10.1080/15567265.2023.2293710 [Link]

2022

Mondal, M. T. H., Hossain, R., Martin, R., and Moore, A. L., “Speed and location tracking of moving multiphase interfaces via a capacitance microsensor array during droplet evaporation ” Micro and Nano Engineering 17, 2022, 100168. DOI: 10.1016/j.mne.2022.100168 [Link]

Spence, T. J. and Moore, A. L., “Phonon thermal transport in silicon thin films with nanoscale constrictions and expansions ” Journal of Applied Physics 131, 2022, 025106. DOI: 10.1063/5.0063744 [Link]

2021

Hossain, R., Lewis, J., and Moore, A. L., “In situ infrared temperature sensing for real-time defect detection in additive manufacturing ” Additive Manufacturing 47, 2021, 102328. DOI: 10.1016/j.addma.2021.102328 [Link]

Mondal, M. T. H., Desai, T., Hossain, R., and Moore, A. L., “Micro-scale tracking of unconstrained moving multiphase contact lines via a capacitance sensor array ” Sensors and Actuators A: Physical 331, 2021, 113046. DOI: 10.1016/j.sna.2021.113046 [Link]

Doran, B., Zhang, B., Davani, S., Osafo, K. A., Sutka, O., Walker, A., Mueller, N., Akwaboa, S., Mensah, P., Meng, W. J., and Moore, A. L., “Spatially periodic vapor bubble activity during subcooled pool boiling on 1D aluminum alloy micro-fin arrays,” International Journal of Heat and Mass Transfer 180, 2021, 121760. DOI: 10.1016/j.ijheatmasstransfer.2021.121760150585. [Link]

Desai, T., Pataory, N. H., Moore, A. L., and Radadia, A., “Effect of pH variation and annealing on covalently assembled nanodiamond films,” Applied Surface Science 565, 2021, 150585. DOI: 10.1016/j.apsusc.2021.150585 [Link]

Davani, S., Rezaei, F., Moore, A. L., and Crews, N. D., “Counter-flow for stabilization of microfluidic thermal reactors: Experimental and numerical study,” Applied Thermal Engineering 188, 2021, 116607. DOI: 10.1016/j.applthermaleng.2021.116607 [Link]

 

2020

Pataory, N. H., Rai, A., Patel, K. P., Rebecca, A., Zhang, W., Ulrich, A. J., Galib, M., Desai, T., Zivanovic, S., Yousufuddin, M., Moore, A. L., and Radadia, A. D., “Directed covalent assembly of nanodiamonds into thin films,” Diamond and Related Materials 101, 2020, 107605. DOI: 10.1016/j.diamond.2019.107605 [Link]

Doran, B., Zhang, B., Walker, A., KC, P., Meng, W. J., and Moore, A. L., “Experimental determination of the role of increased surface area in pool boiling from nanostructured surfaces,” Experimental Thermal and Fluid Science 111, 2020, 109956. DOI: 10.1016/j.expthermflusci.2019.109956 [Link]

 

2019

Ying, H., Moore, A., Cui, J., Liu, Y., Yao, Y., Li, D., Han. S., Wang, Z., Wang, L., and Chen, S., “Tailoring the thermal transport properties of monolayer hexagonal boron nitride by grain size engineering,” 2D Materials 7, 2019, 015031. DOI: 10.1088/2053-1583/ab5ae0 [Link]

Pataory, N. H., Rai, A., Patel, K. P., Rebecca, A., Zhang, W., Ulrich, A. J., Galib, M., Desai, T., Zivanovic, S., Yousufuddin, M., Moore, A. L., and Radadia, A. D., “Directed covalent assembly of nanodiamonds into thin films,” Diamond and Related Materials 101, 2019, 107605. DOI: 10.1016/j.diamond.2019.107605 [Link]

Coe, J., Dunbar, C., Epps, K., Hagensee, J., and Moore, A. L., “A Low-altitude Unmanned Aerial Vehicle (UAV) Created Using 3D-printed Bioplastic,” Journal of Unmanned Vehicle Systems 7(2), 2019, 118-128. DOI: 10.1139/juvs-2017-0023 [Link]

Chowdhury, R. A., Rai, A., Glynn, E., Morgan, P., Moore, A. L., and Youngblood, J. P., “Superior, Processing-Dependent Thermal Conductivity of Cellulose Nanocrystal-Poly(vinyl alcohol) Composite Films,” Polymer 164, 2019, 17-25. DOI: 10.1016/j.polymer.2019.01.006 [Link]

 

2018

Khatri, N., Desai, T., Rai, A., KC, P., and Moore, A. L., "A Batch Fabrication-compatible Multifunctional Thermal Sensor Based on Thin Film Thermocouple and Thermopile Elements," Sensors and Actuators A 280, 2018, 188-196., DOI: 10.1016/j.sna.2018.07.038 [Link]

Daniel, F., Patoary, N. H., Moore, A. L., Weiss, L., and Radadia, A. D., “Temperature-dependent electrical resistance of conductive polylactic acid filament for fused deposition modeling,” The International Journal of Advanced Manufacturing Technology 99, 2018, pp. 1215-1224., DOI: 10.1007/s00170-018-2490-z [Link]

Sonsalla, T., Moore, A. L., Meng, W. J., Radadia, A. D., and Weiss, L., “3-D printer settings effects on the thermal conductivity of acrylonitrile butadiene styrene (ABS),” Polymer Testing 70, 2018, pp. 389-395. DOI: 10.1016/j.polymertesting.2018.07.018 [Link]

Hasan, N., Hou, B., Moore, A., and Radadia, A. “Enhanced Ionic Sensitivity in Solution-Gated Graphene-Hexagonal Boron Nitride Heterostructure Field-Effect Transistors,” Advanced Materials Technologies 3(8), 2018, 1800133. DOI: 10.1002/admt.201800133 [Link]

Weiss, L., Moore, A., Hays, A., Eboda, F., and Borquist, E., “Operational enhancements for small scale thermal energy storage devices,” Microsystem Technologies 24(6), 2018, 2617-2625. DOI:10.1007/s00542-018-3743-3   [Link]

 

2017

KC, P., Rai, A., Ashton, T. S., and Moore, A. L., “APCVD Hexagonal Boron Nitride Thin Films for Passive Near-junction Thermal Management of Electronics,” Nanotechnology 28(50), 2017, 505705. DOI: 10.1088/1361-6528/aa97ae [Link]

Weathers, A., Carrete, J., DeGrave, J. P., Higgins, J. M., Moore, A. L., Kim, J., Mingo, N., Jin, S., and Shi, L., “Glasslike thermal conductivity in nanostructures of a complex anisotropic crystal,” Physical Review B 96, 2017, 214202. DOI: 10.1103/PhysRevB.96.214202. [Link]

Ashton, T. S., and Moore, A. L., “Foam-like Hierarchical Hexagonal Boron Nitride as a Non-traditional Thermal Conductivity Enhancer for Polymer-based Composite Materials,” International Journal of Heat and Mass Transfer 115, 2017, pp. 273-281. DOI: 10.1016/j.ijheatmasstransfer.2017.08.047 [Link]

Bell, C., Nammari, A., Uttamchandani, P., Rai, A., Shah, P., and Moore, A. L., “Flexible Electronics-Compatible Non-enzymatic Glucose Sensing via Transparent CuO Nanowire Networks on PET Films,” Nanotechnology 28(24), 2017, 245502. DOI: 10.1088/1361-6528/aa7164 *Chosen for issue cover* [Link]

Liu, D., Zheng, Y.-L., Moore, A., and Ferdows, Mo., “Spectral Element Simulations of Three Dimensional Convective Heat Transfer,” International Journal of Heat and Mass Transfer 111, 2017, pp. 1023-1038. DOI: 10.1016/j.ijheatmasstransfer.2017.04.066 [Link]

Rai, A. and Moore, A. L., “Enhanced Thermal Conduction and Influence of Interfacial Resistance within Flexible High Aspect Ratio Copper Nanowire/Polymer Composites,” Composites Science and Technology 144, 2017, pp. 70-78. DOI: 10.1016/j.compscitech.2017.03.020 [Link]

Primeaux, P., Zhang, B., Zhang, X., Miller, J., Meng, W., KC, P., and Moore, A. L., “Aluminum-based one- and two- dimensional micro fin array structures: high-throughput fabrication and heat transfer testing,” Journal of Micromechanics and Microengineering 27(2), 2017, 025012. DOI: 10.1088/1361-6439/aa53c9 [Link]

 

2016

KC, P., Nammari, A., Ashton, T. S., and Moore, A. L., "Saturated Pool Boiling Heat Transfer from Vertically Oriented Silicon Surfaces Modified with Foam-like Hexagonal Boron Nitride Nanomaterials," International Journal of Heat and Mass Transfer 95, 2016, pp. 964-971. DOI: 10.1016/j.ijheatmasstransfer.2016.01.006 [Link]

 

2015

Ashton, T. S., and Moore, A. L., “Three-dimensional Foam-like Hexagonal Boron Nitride Nanomaterials via Atmospheric Pressure Chemical Vapor Deposition,” Journal of Materials Science 50(18), 2015, pp. 6220-6226. DOI: 10.1007/s10853-015-9180-0 [Link]

Jo, I., Pettes, M. T., Lindsay, L., Ou, E., Weathers, A., Moore, A. L., Yao, Z., and Shi, L., “Reexamination of Basal Plane Thermal Conductivity of Suspended Graphene Samples Measured by Electro-thermal Micro-Bridge Methods,” AIP Advances 5, 2015, 053206. DOI: 10.1063/1.4921519 [Link]

 

2014

Diaz, Jairo A., Ye, Zhijiang, Wu, Xiawa, Moore, Arden L., Moon, Robert J., Martini, Ashlie, Boday, Dylan, Youngblood, Jeffrey Paul, “Thermal Conductivity in Nanostructured Films: From Single Cellulose Nanocrystals to Bulk Films,” Biomacromolecules 15(11), 2014, pp. 4086-4101. DOI: 10.1021/bm501131a  [Link]

Moore, A. L., and Shi, L., “Emerging Challenges and Materials for Thermal Management of Electronics,” Materials Today 17(4), 2014, pp. 163-174. DOI: http://dx.doi.org/10.1016/j.mattod.2014.04.003 [Link]

 

Pre-2013

Chen, X., Weathers, A., Moore, A. L., Zhou, J. S., Shi, L., “Thermoelectric Properties of Cold-Pressed Higher Manganese Silicides for Waste Heat Recovery,” Journal of Electronic Materials 41, 2012, pp. 1564-1572. [Link]

Zhou, F., Moore, A. L., Bolinsson, J., Persson, A., Fröberg, L., Pettes, M. T., Kong, H., Rabenberg, L., Caroff, P., Stewart, D., Mingo, N., Dick, K. A., Samuelson, L., Linke, H., and Shi, L., “Thermal Conductivity of Indium Arsenide Nanowires with Wurtzite and Zinc Blende Phases,” Physical Review B 83, 2011, 205416. [Link]

Chen, S., Moore, A. L., Cai, W., Suk, J. W., An, J., Mishra, C., Amos, C., Magnuson, C., Kang, J., Shi, L.,and Ruoff, R. S.,  “Raman Measurements of Thermal Transport in Suspended Monolayer Graphene of Variable Sizes in Vacuum and Gaseous Environments,” ACS Nano  5(1), 2011, pp. 321-328. [Link]

Moore, A. L. and Shi, L., “On Errors in Thermal Conductivity Measurements of Suspended and Supported Nanowires Using Micro-thermometer Devices from Low to High Temperatures,” Measurement Science and Technology 22(1), 2011, 015103. [Link]

Seol, J. H., Moore, A. L., Jo, I., Yao, Z., and Shi, L., “Thermal Conductivity Measurement of Graphene Exfoliated on Silicon Dioxide,” Journal of Heat Transfer 133(2), 2011, 022403. [Link]

Cai, W.*, Moore, A. L.*, Zhu, Y., Li, X., Chen, S., Shi, L., and Ruoff, R. S., “Thermal Transport in Suspended and Supported Monolayer Graphene Grown by Chemical Vapor Deposition,” Nano Letters 10, 2010, pp. 1645-1651. *These authors contributed equally to this work. [Link]

Seol, J. H., Jo, I., Moore, A. L., Lindsay, L, Aitken, Z. H., Pettes, M. T., Li, X., Yao, Z., Huang, R., Broido, D., Mingo, N., Ruoff, R. S., and Shi, L., “Two-Dimensional Phonon Transport in Supported Graphene,” Science 328, 2010, pp. 213-216. [Link]

Zhou, F.*, Moore, A. L.*, Pettes, M. T., Lee, Y., Seol, J. H., Ye, Q. L., Rabenberg, L., and Shi, L., “Effect of Growth Base Pressure on the Thermoelectric Properties of Indium Antimonide Nanowires,” Journal of Physics D: Applied Physics 46(2), 2010, 025406.  *These authors contributed equally to this work. [Link]

Moore, A. L., Pettes, M. T., Zhou, F., and Shi, L., “Thermal Conductivity Suppression in Bismuth Nanowires,” Journal of Applied Physics 106(3), 2009, 034310. [Link]

Moore, A. L., Cummings, A. T., Jensen, J. M., Shi, L., and Koo, J. H., “Thermal Conductivity Measurements of Nylon 11-Carbon Nanofiber Nanocomposites,” Journal of Heat Transfer 131(9), 2009, 091602. [Link]

Mavrokefalos, A., Moore, A. L., Pettes, M. T., Shi, L., Wang, W., and Li, X., “Thermoelectric and  Structural Characterizations of Individual Electrodeposited Bismuth Telluride Nanowires,” Journal of Applied Physics 105(10), 2009, 104318. [Link]

Moore, A. L., Saha, S. K., Prasher, R. S. and Shi, L., “Phonon Backscattering and Thermal Conductivity Suppression in Sawtooth Nanowires,” Applied Physics Letters 93, 2008, 083112. [Link]

Zhou, F., Szczech, J., Pettes, M. T., Moore, A. L., Jin, S., and Shi, L., “Determination of Transport Properties in Chromium Disilicide Nanowires via Combined Thermoelectric and Structural Characterization,” Nano Letters 7(6), 2007, pp. 1649-1654. [Link]

Seol, J. H., Moore, A. L., Saha, S. K., Zhou, F., Shi, L., Ye, Q. L., Scheffler, R., Mingo, N., and Yamada, T., “Measurement and Analysis of Thermopower and Electrical  Conductivity of an Indium Antimonide Nanowire from a Vapor-Liquid-Solid Technique,” Journal of Applied Physics 101(2), 2007, 023706. [Link]

Zhou, F., Seol, J. H., Moore, A. L., Shi, L., Ye, Q. L, and Scheffler, R., “One-dimensional Electron Transport and Thermopower in an Individual InSb Nanowire,” Journal of Physics: Condensed Matter 18, 2006, pp. 9651-9657. [Link]

 

CONFERENCE PUBLICATIONS & PRESENTATIONS

Mondal, M. T. H., Alam, M. S., Hossain, R., and Moore, A. L., “Phase Interface Dynamics and Heat Transfer for Subcooled Impacting Droplets on a Heated MEMS Microdevice,” 2023 ASME International Mechanical Engineering Congress & Exposition, New Orleans, LA, 29 October – 2 November 2023.

Hossain, R., Lewis, J., and Moore, A. L., “In Situ Infrared Temperature Sensing for Real-Time Defect Detection in Additive Manufacturing,” 2023 ASME International Mechanical Engineering Congress & Exposition, New Orleans, LA, 29 October – 2 November 2023.

Hossain, R., Lewis, J., and Moore, A. L., “In Situ Infrared Temperature Sensing for Real-Time Defect Detection in Additive Manufacturing,” 2022 ASTM Conference on Additive Manufacturing, Orlando, FL, 31 October – 4 November 2022. Presentation.

Mondal, M. T. H., Hossain, R., Martin, R., and Moore, A. L., “Independent Microscale Sensing of Moving Phase Interface Behavior and Local Surface Temperature During Sessile Water Droplet Evaporation from a Heated Surface,” 2022 ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), Garden Grove, CA, 25-27 June 2021. Presentation..

Mondal, M. T. H., Desai, T., Hossain, R., and Moore, A. L., “Micro-scale tracking of unconstrained moving multiphase contact lines via a capacitance sensor array,” 2021 Micro Flow and Interfacial Phenomena (µFIP) Conference, virtual, 7-9 June 2021. Presentation..

Moore, A. L., “Subcooled Pool Boiling Performance of As-Rolled and Nanostructure-Modified 1D Copper Micro-Fin Arrays Fabricated by High Throughput Roll Molding,” 2020 ASME Summer Heat Transfer Conference, virtual, 13-15 July 2020. Presentation.

Moore, A. L., “Subcooled Pool Boiling Performance of Aluminum Alloy 1D Micro-Fin Arrays Fabricated by High Throughput Roll Molding,” 2019 ASME Summer Heat Transfer Conference, Bellevue, WA, 14-17 July 2019. Presentation.

Moore, A. L., “Emerging Challenges and Materials for Thermal Management of Electronics,” IEEE 18th Intersociety  Conference  on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM), Las Vegas, NV, 28-31 May 2019. Presentation.

Clayton, N., Radadia, A., and Moore, A. L., “Monte Carlo Simulation of Phonon Thermal Transport in Polycrystalline Diamond Thin Films,” 2017 ASME Summer Heat Transfer Conference, Bellevue, WA, 10-12 July 2017. Presentation.

KC, P., Shrestha, S., Radadia, A., Weiss, L., and Moore, A., “Design and Performance of Novel Low-profile Heat Sinks Created Through Additive Manufacturing,” Proceedings of the ASME 2016 International Mechanical Engineering Congress and Exhibition (IMECE), Phoenix, AZ, 11-17 Nov. 2016. DOI: 10.1115/IMECE2016-66320 [Link]

Liu, D., Zheng, Y.-L., and Moore, A. L., “Three Dimensional Simulations of Fluid Flow and Heat Transfer with Spectral Element Method,” XSEDE16 Proceedings of the XSEDE16 Conference on Diversity, Big Data, and Science at Scale, Miami, FL, 17-21 July 2016.  Paper. DOI: 10.1145/2949550.2949569 [Link]

Moore, A. L., “Work in Progress: Experiential Learning in the Thermal Sciences - Introducing and Reinforcing Fundamental Thermodynamics and Heat Transfer Principles to K-12 and Engineering Undergraduate Studentsk,” 123rd Annual American Society for Engineering Education (ASEE) Conference and Exposition, New Orleans, LA, 26-29 June 2016. Presentation and paper. DOI: 10.18260/p.26827 [Link]

Matteson, J., Moore, A. L., Moss, D., Fitch, J., “IT Interactions: Rack and Data Center,” 2013 ASHRAE Winter Conference, Dallas, TX, 26-30 January 2013. Presentation.

Weathers, A., Moore, A. L., Pettes, M. T., Salts, D., Kim, J. H., Dick, K. A., Samuelson, L., Linke, H., Caroff, P., Shi, L., “Phonon Transport and Thermoelectricity in Defect-engineered InAs Nanowires,” Proceedings of MRS 2011 Fall Meeting, Vol. 104, Boston, MA, 28 November – 2 December 2011. Presentation.

Cai, W., Moore, A. L., Chen, S., Zho, Y., Shi, L., and Ruoff, S., “Thermal Transport in Suspended and Supported Monolayer Graphene Grown by Chemical Vapor Deposition,” American Physical Society March 2011 Meeting, Dallas, TX, 21-25 March 2011.  Presentation.

Jo, I., Seol, J. H., Moore, A. L., Pettes, M. T., Lindsay, L., Mingo, N., Broido, D., Yao,  Z., and Shi, L., “Two Dimensional Phonon Transport in Graphene,” American Physical Society March 2011 Meeting, Dallas, TX, 21-25 March 2011.  Presentation.

Seol, J. H., Moore, A. L., Jo, I., Yao, Z., Shi, L., “Thermal Conductivity Measurement of Graphene Exfoliated on Silicon Dioxide,” Proceedings of International Heat Transfer Conference, IHTC14-23295, pp. 519-523,  Washington, D. C., 8-13 August 2010.

Higgins, J. M., Moore, A. L., Pettes, M. T., Shi, L., and Jin, S., “Synthesis and Thermoelectric Properties of MnSiB1.75B Nanowires – Nanostructured Complex Crystals as Thermoelectric Materials,” Materials Research Society 2010 Spring Meeting, San Francisco, CA, 5-9 April 2010.  Presentation.

Moore, A. L., Higgins, J. M., Pettes, M. T., Zhou, F., Jin, S., and Shi, L., “Thermoelectric Properties of Higher Manganese Silicide Nanowires,” American Physical Society March 2009 Meeting, Pittsburgh, PA, 16-20 March 2009.  Presentation.

Moore, A. L., Zhou, F., Pettes, M. T., Mavrokefalos, A., and Shi, L., “Investigation of Thermoelectric Transport in Individual Bismuth Nanowires,” American Physical Society March 2008 Meeting, New Orleans, LA, 11-14 March 2008. Presentation.

Moore, A. L., Zhou, F., Pettes, M. T., Mavrokefalos, A., and Shi, L., “Synthesis and Thermoelectric Measurement of Individual Bismuth Nanowires,” 2006 ASME International Mechanical Engineering Congress and Exposition, Chicago, IL, 5-10 November 2006. Presentation and paper.

Daines, R., Ahuja, V., Hosangadi, A., Shipman, J., Moore, A. and Sulyma, P. "Computational Modeling of Liquid and Gaseous Control Valves," 41PstP AIAA/ASME/SAE/ASEE Joint Propulsion Conference and Exhibit, AIAA Paper No. 2005-4543, Tucson, AZ, 10-13 July 2005. Paper.

 

BOOK CHAPTERS

Moore, A. L., Advances in Materials Engineering for Conduction-Limited Direct Contact Cooling. In Embedded Cooling of Electronic Devices: Conduction, Evaporation, and Single- and Two-Phase Convection, Iyengar, M.; Weibel, J. A.; Asheghi, M., Eds. World Scientific: 2024; Vol. 8, pp 275-310. DOI: 10.1142/9789811279379_0007

 

PATENTS

US Patent US 10781351 B1, “Hexagonal Boron Nitride Thermal Conductivity Enhancing Materials and Method of Making,” Moore, A. L., 2020.

US Patent US 9261930 B2, “Electronics Enclosure with Redundant Thermal Sensing Architecture,” Moore, A. L., 2016.

US Patent US 9277677 B2, “Cooling an Electronic Device Using a Thermally Conductive Loop,” Elison, B., Mann, P., Moore, A. L, and Sinha, A., 2016.

US Patent US 9265179 B2, “Continuous Loop Cooling for an Electronic Device,” Elison, B., Mann, P., Moore, A. L, and Sinha, A., 2016.

US Patent US 9296246 B2, “Anti-counterfeiting Opto-thermal Watermark for Electronics,” Cruz, E., Harper, M. W., Kruse, R., Moore, A. L., and Veraa, B. G., 2016.

US Patent US 9243943 B2, “Airflow Sensor for Adapter Slots in a Data Processing System,” Moore, A.  L., Pizzolato, K., and Westmark, C., 2016.

US Patent US 9090004 B2, “Composites Comprised of Aligned Carbon Fibers in Chain-aligned Polymer Binder,” Kuczynski, J., Mikhail, A., and Moore, A. L., 2015.

US Patent US 8911244 B2, “Receptacle with Heat Management for Electronics and Optical Systems,” Elison, B., Mann, P., Moore, A. L., and Sinha, A., 2014.

US Patent US 8764405 B2 and US 8936443 B2, “Dynamic Compensation of Airflow in Electronics Enclosures with Failed Fans,” Moore, A. L., Pizzolato, K., and Mashak, B., 2014.

US Patent Application US 20150092349 A1, “Implementing Redundant and High Efficiency Hybrid Liquid and Air Cooling for Chipstacks,” Moore, A. L., Elison, B., Mann, P., and Sinha, A., 2015.

US Patent Application US 20160018008 A1 and US 20150192219 A1, “Air Valve for Electronics Enclosures,” Anderl, J., Elison, B., Mann, P., Moore, A. L., and Sinha, A., 2015.

US Patent Application US 20140312750 A1, “Computer System Component Bay,” Moore, A. L., Elison, B., Sinha, A., and Mann, P., 2014.

US Patent Application US 20140305184 A1, “Techniques for Calibrating an Air-flow Sensor for Adapter Slots in a Data Processing System,” Moore, A. L, Pizzolato, K., and Westmark, C., 2014.